Bridgeless Totem-Pole PFC: TP65H035G4WS vs TP65H050G4WS
In server PSUs, telecom supplies, and high-density adapters, bridgeless totem-pole PFC removes bridge-diode loss—then silicon FRD reverse recovery on the hard-switched leg often becomes the limiter. 650 V GaN FETs (especially cascode SuperGaN) are a common evaluation path thanks to very low Qrr and drive with familiar silicon gate drivers.
On the Transphorm / Renesas Gen IV platform, TP65H035G4WS (35 mΩ) and TP65H050G4WS (50 mΩ) sit in the same 650 V totem-pole-friendly pool and split mainly by RDS(on) and thermal package. Use the product-page datasheet PDF; qualify on the bench before production.
What GaN solves in totem-pole PFC
The high-frequency totem-pole leg often runs hard- or quasi-hard-switched: silicon SJ body-diode recovery raises loss and EMI. A GaN cascode pairs a HV GaN HEMT with a LV Si MOSFET aiming for lower crossover loss and Qrr while still using common gate drivers. This article does not restate the general GaN-vs-SiC primer—it only answers: within the same 650 V pool, how to choose 035 vs 050.
How to split TP65H035G4WS / TP65H050G4WS
| PN | Key metrics (datasheet) | Better fit | Product page |
|---|---|---|---|
| TP65H035G4WS | 650 V / 35 mΩ; SuperGaN Gen IV; bridgeless totem-pole PFC; common gate drive; GSD-oriented layout | Higher density / lower conduction-loss budgets in totem-pole and HF AC-DC | 12 |
| TP65H050G4WS | 650 V / 50 mΩ; TO-247; same Gen IV SuperGaN platform | Mid-power totem-pole, existing TO-247 heatsink tooling, cost/current trade-off | 427 |
Both are 650 V Gen IV candidates. The split is mainly RDS(on) and thermal package—not “any 650 V GaN works.”
8-step totem-pole GaN checklist
- Topology / mode: CCM vs CrM; hard-switched vs slow-recovery leg roles.
- Current & RDS(on): conduction loss inside the thermal budget—size 035 vs 050 on loss first.
- Package & cooling: hole pattern, insulator, creepage; do not mix TO-247 tooling blindly.
- Gate drive: common Si drivers vs datasheet gate margins / Miller needs.
- Layout / GSD: keep power and gate loops short; use GSD-oriented layout to tame HF ringing.
- EMI / waveforms: no-load to full-load switching and conducted emissions; tune dead time, snubbers, magnetics.
- Protection / surge: OV, surge current, short-circuit coverage for totem-pole faults.
- Sampling & second source: pilot before mainline; datasheets, MOQ, and selection support via Jarwey.
Important: A cross-reference starts evaluation—it is not pin-to-pin without validation.
Why teams evaluate this path
- Aligns with common 650 V bridgeless totem-pole PFC needs while helping control BOM cost
- Specs are checkable on the product datasheet (RoHS, RDS(on), dynamic metrics)
- Flexible delivery: sampling, small batch, and lead-time coordination; split 35 mΩ / 50 mΩ by power class
- Useful for server/telecom PSU evaluation kits and channel kits
Datasheets & inquiry
- TP65H035G4WS (650 V / 35 mΩ) · PDF on product page
- TP65H050G4WS (650 V / 50 mΩ) · PDF on product page
- Related: 650 V SiC SBD PFC freewheel
Send your current PFC switch PN, power class, CCM/CrM, and package to Jarwey for candidates, samples, and lead time: kerry.w@jarwey.cn · Contact
Takeaway
For 650 V bridgeless totem-pole PFC, first split by current and thermal budget between TP65H035G4WS (35 mΩ) and TP65H050G4WS (50 mΩ), then close drive, layout, and EMI. Samples, lead time, and selection support: Jarwey.
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